In the era of high-density SMT assembly, issues such as incorrect or missing components during the splicing process can easily lead to batch-level quality defects. The LCR Measurement Optional System of Youngpool Technology’s L-900 Automatic Splicing Machine establishes a reliable quality safeguard for the splicing process with its unique “variable-pin” design and independent three-axis motion architecture.

Traditional splicing processes mainly focus on the physical connection of carrier tapes, lacking effective verification of components' electrical characteristics. The L-900 Automatic Splicing Machine's measurement system adopts an independent X/Y/Z axis structure, fully separated from the lamination and vision systems. This means that the measurement process does not interfere with the splicing rhythm while ensuring testing stability. Its innovative variable-pin mechanism automatically adjusts the testing gap according to the component size, capable of accurately measuring miniature components as small as 01005 packages. The dual-sided contact measurement method ensures reliable probe-to-electrode contact, covering a wide testing range—from 0 μH to 1000 H for inductance, 0 pF to 20 mF for capacitance, and 0 Ω to 20 MΩ for resistance.

In practical operation, the workflow of this system is particularly noteworthy. When the carrier tape reaches the measurement station, the system first performs visual positioning of the component. Then, the variable-pin mechanism automatically adjusts the probe distance. With a measurement accuracy of ±0.05%, even minor parameter deviations can be detected. For miniature components such as 01005, the testing pass rate remains above 95%, which is a remarkable breakthrough for the splicing stage.

More importantly, this system is deeply integrated with the splicing process. Operators can complete component value testing, polarity detection, and optional silkscreen recognition simultaneously during splicing—achieving a true “splice-and-inspect” one-stop operation. When abnormal readings are detected, the system immediately triggers an alarm and pauses splicing, preventing incorrect components from entering the production line at the source.

This forward-shifted inspection concept—moving quality verification to the splicing stage—is especially suitable for applications demanding extreme reliability, such as automotive electronics and medical devices. It is not merely a detection tool but a transformation in process control philosophy: establishing a quality checkpoint at the very front of material feeding significantly reduces rework and inspection costs after placement and reflow soldering.

In the pursuit of zero-defect manufacturing, the L-900's measurement system represents a new direction in splicing technology—evolving from simple tape connection to an intelligent material verification platform, providing a new solution for quality management in SMT production.