As SMT manufacturing continues to evolve toward high-density assembly and high-reliability requirements, the impact of cleaning processes on yield has gradually shifted from a “supporting step” to a “critical control point.” Particularly before and after placement, as well as at key inspection stages, ineffective control of particulate contamination on PCBs and components can easily lead to defect...

During SMT production, companies usually focus on placement accuracy, production efficiency, and equipment stability. However, PCB surface cleanliness also plays an important role in ensuring the stability of subsequent processes. As electronic products continue to develop toward higher density and higher precision, PCB structures are becoming increasingly complex. Areas such as through-holes and ...